[B-1-4] Feasibility of Direct Bonding Between CMP-Cu Films at Room Temperature for Bumpless Interconnect

Akitsu Shigetou, Naoe Hosoda, Toshihiro Itoh, Tadatomo Suga (1.Research Center for Advanced Science and Technology, The University of Tokyo)

https://doi.org/10.7567/SSDM.2001.B-1-4