High-Accuracy Analysis of Interconnect Capacitance for Floating Metal Fills

Takashi Tameshige; Yoshiaki Takemura; Ken Yamaguchi Nobuhiro Konishi; Shinichi Fukada; Takuya Maruizumi

doi:https://doi.org/10.7567/SSDM.2001.F-5-3

[F-5-3] High-Accuracy Analysis of Interconnect Capacitance for Floating Metal Fills

Takashi Tameshige, Yoshiaki Takemura, Ken Yamaguchi Nobuhiro Konishi, Shinichi Fukada, Takuya Maruizumi (1.Advanced Research Laboratory, Hitachi Ltd., 2.Device Development Center, Hitachi Ltd.)

https://doi.org/10.7567/SSDM.2001.F-5-3

2001 International Conference on Solid State Devices and Materials

[F-5-3] High-Accuracy Analysis of Interconnect Capacitance for Floating Metal Fills