High-Accuracy Analysis of Interconnect Capacitance for Floating Metal Fills

Takashi Tameshige; Yoshiaki Takemura; Ken Yamaguchi Nobuhiro Konishi; Shinichi Fukada; Takuya Maruizumi

doi:https://doi.org/10.7567/SSDM.2001.F-5-3

[F-5-3] High-Accuracy Analysis of Interconnect Capacitance for Floating Metal Fills

Takashi Tameshige、Yoshiaki Takemura、Ken Yamaguchi Nobuhiro Konishi、Shinichi Fukada、Takuya Maruizumi (1.Advanced Research Laboratory, Hitachi Ltd.、2.Device Development Center, Hitachi Ltd.)

https://doi.org/10.7567/SSDM.2001.F-5-3

2001 International Conference on Solid State Devices and Materials

[F-5-3] High-Accuracy Analysis of Interconnect Capacitance for Floating Metal Fills