Micro Bump Interconnection Technologies in 20 μm Pitch on 3D System in Package

Tadahiro Morifuji; Yoshihiro Tomita; Ryoichi Kajiwara; Kenji Takahashi

doi:https://doi.org/10.7567/SSDM.2001.LB-1-1

[LB-1-1] Micro Bump Interconnection Technologies in 20 μm Pitch on 3D System in Package

Tadahiro Morifuji, Yoshihiro Tomita, Ryoichi Kajiwara, Kenji Takahashi (1.Association of Super-Advanced Electronics Technologies (ASET) Electronic System Integration Technology Research Department, Tsukuba Research Center Room C-B-5, Tsukuba Center Inc.)

https://doi.org/10.7567/SSDM.2001.LB-1-1

2001 International Conference on Solid State Devices and Materials

[LB-1-1] Micro Bump Interconnection Technologies in 20 μm Pitch on 3D System in Package