[LB-1-1] Micro Bump Interconnection Technologies in 20 μm Pitch on 3D System in Package
Tadahiro Morifuji, Yoshihiro Tomita, Ryoichi Kajiwara, Kenji Takahashi
(1.Association of Super-Advanced Electronics Technologies (ASET) Electronic System Integration Technology Research Department, Tsukuba Research Center Room C-B-5, Tsukuba Center Inc.)
https://doi.org/10.7567/SSDM.2001.LB-1-1