[B-2-4] Low-cost Cu Interconnects Using Direct Patterning Process (DPP) of Photo-sensitive MSZ with Low-k, Bottom Anti-reflective layer

Munehiro Tada、Takashi Ogura、Yoshihiro Hayashi (1.Silicon Systems Research Laboratories, NEC Corporation)

https://doi.org/10.7567/SSDM.2002.B-2-4