[B-9-3] Impact of Thermal Budget Reduction on MOSFET Performance to Achieve High-speed and High-density DRAM-based System LSI

E. Yoshida、T. Miyashita、H. Nitta、M. Tanaka、K. Ishii、Y. Akasaka、P. H. Chou、K. Hashimoto、Y. Kohyama、T. Tanaka、Y. Nara (1.Fujitsu Laboratories Ltd.、2.Toshiba Corporation Semiconductor Company、3.Winbond Electronics Corp.)

https://doi.org/10.7567/SSDM.2002.B-9-3