Thermal Analysis of Self-Heating Effect in Three Dimensional LSI

T. Nakamura; Y. Yamada; T. Morooka; Y. Igarashi; J. C. Shim; H. Kurino; M. Koyanagi

doi:https://doi.org/10.7567/SSDM.2002.F-4-4

2002 International Conference on Solid State Devices and Materials

2002年9月17日〜 2002年9月19日
Nagoya Congress Center, Nagoya, Japan

[F-4-4] Thermal Analysis of Self-Heating Effect in Three Dimensional LSI

T. Nakamura、Y. Yamada、T. Morooka、Y. Igarashi、J. C. Shim、H. Kurino、M. Koyanagi (1.Dept. of Machine Intelligence and Systems Engineering, Tohoku University)

https://doi.org/10.7567/SSDM.2002.F-4-4

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