Thermal Analysis of Self-Heating Effect in Three Dimensional LSI

T. Nakamura; Y. Yamada; T. Morooka; Y. Igarashi; J. C. Shim; H. Kurino; M. Koyanagi

doi:https://doi.org/10.7567/SSDM.2002.F-4-4

2002 International Conference on Solid State Devices and Materials

Sep 17, 2002 - Sep 19, 2002
Nagoya Congress Center, Nagoya, Japan

[F-4-4] Thermal Analysis of Self-Heating Effect in Three Dimensional LSI

T. Nakamura, Y. Yamada, T. Morooka, Y. Igarashi, J. C. Shim, H. Kurino, M. Koyanagi (1.Dept. of Machine Intelligence and Systems Engineering, Tohoku University)

https://doi.org/10.7567/SSDM.2002.F-4-4

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