[P3-22] Fabrication and electrical properties of buried tungsten structure for direct three dimensional integration

Hong Seung Kim, Lei Xue, Arvind Kumar, Sandip Tiwari (1.School of Electrical Engineering and Computer Engineering, Cornell University, 2.Ultra-high speed communication IC team, ETRI)

https://doi.org/10.7567/SSDM.2002.P3-22