[P3-22] Fabrication and electrical properties of buried tungsten structure for direct three dimensional integration

Hong Seung Kim、Lei Xue、Arvind Kumar、Sandip Tiwari (1.School of Electrical Engineering and Computer Engineering, Cornell University、2.Ultra-high speed communication IC team, ETRI)

https://doi.org/10.7567/SSDM.2002.P3-22