Body Contact Structure using Elevated Field Insulator for Ultra-Thin Film SOI-MOSFETs

S. Yamagami; R. Koh; H. Wakabayashi; J.-W. Lee; Y. Saito; A. Ogura; M. Narihiro; K. Arai; H. Takemura; Y. Ochiai; K. Takeuchi; T. Mogami

doi:https://doi.org/10.7567/SSDM.2003.B-10-4

2003 International Conference on Solid State Devices and Materials

Sep 16, 2003 - Sep 18, 2003
Keio Plaza Inter-Continental Tokyo (Keio Plaza Hotel), Tokyo, Japan

[B-10-4] Body Contact Structure using Elevated Field Insulator for Ultra-Thin Film SOI-MOSFETs

S. Yamagami, R. Koh, H. Wakabayashi, J.-W. Lee, Y. Saito, A. Ogura, M. Narihiro, K. Arai, H. Takemura, Y. Ochiai, K. Takeuchi, T. Mogami (1.Silicon Systems Research Laboratories and R&D Technical Support Center, NEC Corporation)

https://doi.org/10.7567/SSDM.2003.B-10-4

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