CVD-Al/Flow-Al Technology for Filling Large Aspect Ratio Contact Holes

Manabu Sakamoto; Tomoharu Aoki; Kazuya Masu; Se Ju Lim; Masanobu Hatanaka; Michio Ishikawa; Yuji Furumura

doi:https://doi.org/10.7567/SSDM.2003.C-6-4

2003 International Conference on Solid State Devices and Materials

Sep 16, 2003 - Sep 18, 2003
Keio Plaza Inter-Continental Tokyo (Keio Plaza Hotel), Tokyo, Japan

[C-6-4] CVD-Al/Flow-Al Technology for Filling Large Aspect Ratio Contact Holes

Manabu Sakamoto, Tomoharu Aoki, Kazuya Masu, Se Ju Lim, Masanobu Hatanaka, Michio Ishikawa, Yuji Furumura (1.Precision and Intelligence Laboratory, Tokyo Institute of Technology, 2.Institute for Semiconductor Technologies, ULVAC Inc., 3.Philbridge Inc.)

https://doi.org/10.7567/SSDM.2003.C-6-4

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