[C-6-4] CVD-Al/Flow-Al Technology for Filling Large Aspect Ratio Contact Holes

Manabu Sakamoto、Tomoharu Aoki、Kazuya Masu、Se Ju Lim、Masanobu Hatanaka、Michio Ishikawa、Yuji Furumura (1.Precision and Intelligence Laboratory, Tokyo Institute of Technology、2.Institute for Semiconductor Technologies, ULVAC Inc.、3.Philbridge Inc.)

https://doi.org/10.7567/SSDM.2003.C-6-4