Advanced SiGe-free Strained Si on Insulator Substrates: Thermal Stability and Carrier Mobility Enhancement

T. A. Langdo; M. Erdtmann; C. W. Leitz; M. T. Currie; A. Lochtefeld; Z. Cheng; J. A. Carlin; V. K. Yang; C. J. Vineis; C. Major; G. Braithwaite; H. Badawi; M. T. Bulsara

doi:https://doi.org/10.7567/SSDM.2003.D-8-5L

2003 International Conference on Solid State Devices and Materials

Sep 16, 2003 - Sep 18, 2003
Keio Plaza Inter-Continental Tokyo (Keio Plaza Hotel), Tokyo, Japan

[D-8-5L] Advanced SiGe-free Strained Si on Insulator Substrates: Thermal Stability and Carrier Mobility Enhancement

T. A. Langdo, M. Erdtmann, C. W. Leitz, M. T. Currie, A. Lochtefeld, Z. Cheng, J. A. Carlin, V. K. Yang, C. J. Vineis, C. Major, G. Braithwaite, H. Badawi, M. T. Bulsara (1.AmberWave Systems Corporation)

https://doi.org/10.7567/SSDM.2003.D-8-5L

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