3D System Integration by Chip-to-Wafer Stacking Technologies

Peter Ramm; Armin Klumpp; Reinhard Merkel; Josef Weber; Robert Wieland; Gunter Elst

doi:https://doi.org/10.7567/SSDM.2003.G-4-1

2003 International Conference on Solid State Devices and Materials

2003年9月16日〜 2003年9月18日
Keio Plaza Inter-Continental Tokyo (Keio Plaza Hotel), Tokyo, Japan

[G-4-1] 3D System Integration by Chip-to-Wafer Stacking Technologies

Peter Ramm、Armin Klumpp、Reinhard Merkel、Josef Weber、Robert Wieland、Gunter Elst (1.Fraunhofer Institute for Reliability and Microintegration, Munich Division、2.Fraunhofer Institute for Integrated Circuits, Dresden Division)

https://doi.org/10.7567/SSDM.2003.G-4-1

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