3D System Integration by Chip-to-Wafer Stacking Technologies

Peter Ramm; Armin Klumpp; Reinhard Merkel; Josef Weber; Robert Wieland; Gunter Elst

doi:https://doi.org/10.7567/SSDM.2003.G-4-1

2003 International Conference on Solid State Devices and Materials

Sep 16, 2003 - Sep 18, 2003
Keio Plaza Inter-Continental Tokyo (Keio Plaza Hotel), Tokyo, Japan

[G-4-1] 3D System Integration by Chip-to-Wafer Stacking Technologies

Peter Ramm, Armin Klumpp, Reinhard Merkel, Josef Weber, Robert Wieland, Gunter Elst (1.Fraunhofer Institute for Reliability and Microintegration, Munich Division, 2.Fraunhofer Institute for Integrated Circuits, Dresden Division)

https://doi.org/10.7567/SSDM.2003.G-4-1

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