The Japan Society of Applied Physics

[G-4-2] Micro Cu Bump Interconnection on 3D Chip Stacking Technology

Kazumasa Tanida、Mitsuo Umemoto、Naotaka Tanaka、Yoshihiro Tomita、Kenji Takahashi (1.Association of Super -Advanced Electronics Technologies (ASET) Electronic System Integration Technology Research Department, Tsukuba Research Center)

https://doi.org/10.7567/SSDM.2003.G-4-2