[G-4-4L] Fabrication of High-Density Wiring Interposer for 10 GHz 3D Packaging Using a Photosensitive Multiblock Copolymerized Polyimide

Katsuya Kikuchi、Shigemasa Segawa、Eun-Sil Jung、Yoshihiko Nemoto、Hiroshi Nakagawa、Kazuhiko Tokoro、Masahiro Aoyagi (1.National Institute of Advanced Industrial Science and Technology (AIST)、2.PI Research and Development Co., Ltd.、3.Electronic System Integration Technology Research Development, Association of Super-Advanced Electronics Technologies (ASET))

https://doi.org/10.7567/SSDM.2003.G-4-4L