[G-4-4L] Fabrication of High-Density Wiring Interposer for 10 GHz 3D Packaging Using a Photosensitive Multiblock Copolymerized Polyimide

Katsuya Kikuchi, Shigemasa Segawa, Eun-Sil Jung, Yoshihiko Nemoto, Hiroshi Nakagawa, Kazuhiko Tokoro, Masahiro Aoyagi (1.National Institute of Advanced Industrial Science and Technology (AIST), 2.PI Research and Development Co., Ltd., 3.Electronic System Integration Technology Research Development, Association of Super-Advanced Electronics Technologies (ASET))

https://doi.org/10.7567/SSDM.2003.G-4-4L