Evaluation of Hot-Carrier Hardness and Thick-Film Formation with STP Technique for Seamless Integration Technology

N. Sato; N. Shimoyama; T. Kamei; K. Kudou; M. Yano; H. Ishii; K. Machida

doi:https://doi.org/10.7567/SSDM.2003.G-5-3

2003 International Conference on Solid State Devices and Materials

2003年9月16日〜 2003年9月18日
Keio Plaza Inter-Continental Tokyo (Keio Plaza Hotel), Tokyo, Japan

[G-5-3] Evaluation of Hot-Carrier Hardness and Thick-Film Formation with STP Technique for Seamless Integration Technology

N. Sato、N. Shimoyama、T. Kamei、K. Kudou、M. Yano、H. Ishii、K. Machida (1.NTT Microsystem Integration Laboratories, NTT Corporation、2.NTT Advanced Technology Corporation)

https://doi.org/10.7567/SSDM.2003.G-5-3

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