The Japan Society of Applied Physics

[G-5-3] Evaluation of Hot-Carrier Hardness and Thick-Film Formation with STP Technique for Seamless Integration Technology

N. Sato, N. Shimoyama, T. Kamei, K. Kudou, M. Yano, H. Ishii, K. Machida (1.NTT Microsystem Integration Laboratories, NTT Corporation, 2.NTT Advanced Technology Corporation)

https://doi.org/10.7567/SSDM.2003.G-5-3