Evaluation of Hot-Carrier Hardness and Thick-Film Formation with STP Technique for Seamless Integration Technology

N. Sato; N. Shimoyama; T. Kamei; K. Kudou; M. Yano; H. Ishii; K. Machida

doi:https://doi.org/10.7567/SSDM.2003.G-5-3

2003 International Conference on Solid State Devices and Materials

Sep 16, 2003 - Sep 18, 2003
Keio Plaza Inter-Continental Tokyo (Keio Plaza Hotel), Tokyo, Japan

[G-5-3] Evaluation of Hot-Carrier Hardness and Thick-Film Formation with STP Technique for Seamless Integration Technology

N. Sato, N. Shimoyama, T. Kamei, K. Kudou, M. Yano, H. Ishii, K. Machida (1.NTT Microsystem Integration Laboratories, NTT Corporation, 2.NTT Advanced Technology Corporation)

https://doi.org/10.7567/SSDM.2003.G-5-3

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