[F-3-1] Process Realization for 3-D ICs using Fine Pitch Through Silicon Vias
L. Schaper、S. Spiesshoefer、S. Burkett、G. Vangara、Z. Rahman、S. Polamreddy
(1.University of Arkansas, High Density Electronics Center)
https://doi.org/10.7567/SSDM.2004.F-3-1
