Application of High Reliable Silicon Thru-Via to Image Sensor CSP

Kojiro Kameyama; Yoshio Okayama; Mitsuo Umemoto; Akira Suzuki; Hiroshi Terao; Masataka Hoshino; Kenji Takahashi

doi:https://doi.org/10.7567/SSDM.2004.F-3-2

2004 International Conference on Solid State Devices and Materials

Sep 14, 2004 - Sep 17, 2004
Tower Hall Funabori, Tokyo, Japan

[F-3-2] Application of High Reliable Silicon Thru-Via to Image Sensor CSP

Kojiro Kameyama, Yoshio Okayama, Mitsuo Umemoto, Akira Suzuki, Hiroshi Terao, Masataka Hoshino, Kenji Takahashi (1.Association of Super-Advanced Electronic Technologies (ASET))

https://doi.org/10.7567/SSDM.2004.F-3-2

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