[P5-6] Low Temperature Formation of Highly Thermal Immune Ni Germanosilicide Using NiPt Alloy with Co Over-layer in Si1-xGex according to Different Ge Fractions (x)

Jang-Gn Yun、Soon-Young Oh、Bin-Feng Huang、Yong-Jin Kim、Hee-Hwan Ji、Yong-Goo Kim、Yeong-Cheol Kim、Seong-Hyung Park、Heui-Seung Lee、Dae-Byung Kim、Ui-Sik Kim、Han-Seob Cha、Sang-Bum Hu、Jeong-Gun Lee、Hi-Deok Lee (1.Dept. of Electronics Engineering, Chungnam National University、2.Dept. of Materials Engineering, Korea University of Technology and Education、3.System IC R&D Division, Hynix Semiconductor Inc.)

https://doi.org/10.7567/SSDM.2004.P5-6