New Three-Dimensional Integration Technology Using Chip-to-Wafer Bonding to Achieve Ultimate Super Chip Integration

Takafumi Fukushima; Yusuke Yamada; Hirokazu Kikuchi; Mitsumasa Koyanagi

doi:https://doi.org/10.7567/SSDM.2005.C-2-3

2005 International Conference on Solid State Devices and Materials

2005年9月12日〜 2005年9月15日
International Conference Center Kobe, Kobe, Japan

[C-2-3] New Three-Dimensional Integration Technology Using Chip-to-Wafer Bonding to Achieve Ultimate Super Chip Integration

Takafumi Fukushima、Yusuke Yamada、Hirokazu Kikuchi、Mitsumasa Koyanagi (1.Department of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University)

https://doi.org/10.7567/SSDM.2005.C-2-3

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