The Japan Society of Applied Physics

[C-2-3] New Three-Dimensional Integration Technology Using Chip-to-Wafer Bonding to Achieve Ultimate Super Chip Integration

Takafumi Fukushima、Yusuke Yamada、Hirokazu Kikuchi、Mitsumasa Koyanagi (1.Department of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University)

https://doi.org/10.7567/SSDM.2005.C-2-3