[C-2-3] New Three-Dimensional Integration Technology Using Chip-to-Wafer Bonding to Achieve Ultimate Super Chip Integration

Takafumi Fukushima, Yusuke Yamada, Hirokazu Kikuchi, Mitsumasa Koyanagi (1.Department of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University)

https://doi.org/10.7567/SSDM.2005.C-2-3