[C-5-4] Width Scaling and Layout Variation Effects on Dual Damascene Copper Interconnects Electromigration

M. H. Lin、K. P. Chang、K. C. Su、Tahui Wang (1.United Microelectronics Corp.、2.Department of Electronics Engineering, National Chiao-Tung University)

https://doi.org/10.7567/SSDM.2005.C-5-4