[C-6-2] Via-Profile Controlled, Porous Low-k/ Cu DDIs with High Thermal Stability

H. Ohtake、S. Saito、M. Tagami、M. Tada、M. Abe、N. Furutake、Y. Hayashi (1.System Devices Research Laboratories, NEC Corporation)

https://doi.org/10.7567/SSDM.2005.C-6-2