[C-6-2] Via-Profile Controlled, Porous Low-k/ Cu DDIs with High Thermal Stability

H. Ohtake, S. Saito, M. Tagami, M. Tada, M. Abe, N. Furutake, Y. Hayashi (1.System Devices Research Laboratories, NEC Corporation)

https://doi.org/10.7567/SSDM.2005.C-6-2