[D-2-2] Integrated RF-MEMS Technology with Wafer-Level Encapsulation

Kei Kuwabara、Masami Urano、Junichi Kodate、Norio Sato、Tomomi Sakata、Hiromu Ishii、Toshikazu Kamei、Kazuhisa Kudou、Masaki Yano、Katsuyuki Machida (1.NTT Microsystem Integration Laboratories, NTT Corporation、2.NTT Advanced Technology Corporation)

https://doi.org/10.7567/SSDM.2005.D-2-2