Mismatches under the Impact of Hot Carrier Stress in 0.15 μm Technology

S. Y. Chen; J. C. Lin; H. W. Chen; H. C. Lin; Z. W. Jhou; S. Chou; J. Ko; T. F. Lei; H. S. Haung

doi:https://doi.org/10.7567/SSDM.2005.D-9-4

[D-9-4] Mismatches under the Impact of Hot Carrier Stress in 0.15 μm Technology

S. Y. Chen, J. C. Lin, H. W. Chen, H. C. Lin, Z. W. Jhou, S. Chou, J. Ko, T. F. Lei, H. S. Haung (1.Institute of Mechatronics Engineering, National Taipei University of Technology, 2.Special Technology Division, United Microelectronics Corporation, 3.Department of Electronics Engineering, National Chiao Tung University)

https://doi.org/10.7567/SSDM.2005.D-9-4

2005 International Conference on Solid State Devices and Materials

[D-9-4] Mismatches under the Impact of Hot Carrier Stress in 0.15 μm Technology