[P2-9] High Aspect-Ratio Through-Wafer Interconnections with Thick Oxidized Porous Silicon Sidewall Via

Bun-Joong Kim、Man-Lyun Ha、Young-Se Kwon (1.Korea Advanced Institute of Science and Technology, Department of Electrical Engineering and Computer Science)

https://doi.org/10.7567/SSDM.2005.P2-9