[P3-3] DC Hot Carrier Reliability at Elevated Temperatures for nMOSFETs Using 0.13μm Technology

J. C. Lin, S. Y. Chen, H. W. Chen, Z. W. Jhou, H. C. Lin, S. Chou, J. Ko, T. F. Lei, H. S. Haung (1.Special Technology Division, United Microelectronics Corporation, 2.Institute of Mechatronics Engineering, National Taipei University of Technology, 3.Department of Electronics Engineering, National Chiao Tung University)

https://doi.org/10.7567/SSDM.2005.P3-3