The Japan Society of Applied Physics

533件中(111 - 120)

[D-2-3] Thinning technology for lithium niobate wafer by surface activated bonding and chemical mechanical polishing

C. C. Wu、R. H. Horng、D. S. Wuu、T. N. Chen、C. J. Ting、H.Y. Tsai、C. P. Chou (1.Department of Materials Engineering, National Chung Hsing University、2.Institute of Precision Engineering, National Chung Hsing University、3.Mechanical Industry Research Laboratories, Industrial Technology Research Institute、4.Department of Mechanical Engineering, National Chiao Tung University)

2005 International Conference on Solid State Devices and Materials |PDF ダウンロード

533件中(111 - 120)