MEMS Wafer Level Packaging by Using Surface Activated Bonding

Yoshiyuki Takegawa; Toru Baba; Takafumi Okudo; Yuji Suzuki

doi:https://doi.org/10.7567/SSDM.2006.A-3-5

2006 International Conference on Solid State Devices and Materials

2006年9月12日〜 2006年9月15日
PACIFICO Yokohama, Yokohama, Japan

[A-3-5] MEMS Wafer Level Packaging by Using Surface Activated Bonding

Yoshiyuki Takegawa、Toru Baba、Takafumi Okudo、Yuji Suzuki (1.EMIT Devices Development Department、2.Micro Fabrication Process Development Center, Matsushita Electric Works, Ltd.)

https://doi.org/10.7567/SSDM.2006.A-3-5

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