[A-3-5] MEMS Wafer Level Packaging by Using Surface Activated Bonding

Yoshiyuki Takegawa, Toru Baba, Takafumi Okudo, Yuji Suzuki (1.EMIT Devices Development Department, 2.Micro Fabrication Process Development Center, Matsushita Electric Works, Ltd.)

https://doi.org/10.7567/SSDM.2006.A-3-5