60% Power Reduction in Inductive-Coupling Inter-Chip Link by Current-Sensing Technique

Kiichi Niitsu; Noriyuki Miura; Mari Inoue; Yoshihiro Nakagawa; Masamoto Tago; Muneo Fukaishi; Hiroki Ishikuro; Tadahiro Kuroda

doi:https://doi.org/10.7567/SSDM.2006.C-2-1

[C-2-1] 60% Power Reduction in Inductive-Coupling Inter-Chip Link by Current-Sensing Technique

Kiichi Niitsu、Noriyuki Miura、Mari Inoue、Yoshihiro Nakagawa、Masamoto Tago、Muneo Fukaishi、Hiroki Ishikuro、Tadahiro Kuroda (1.Keio University, Department of Electronics and Electrical Engineering、2.NEC Corporation)

https://doi.org/10.7567/SSDM.2006.C-2-1

2006 International Conference on Solid State Devices and Materials

[C-2-1] 60% Power Reduction in Inductive-Coupling Inter-Chip Link by Current-Sensing Technique