Device Isolation by Plasma Treatment for Planar Integration of E/D-mode AlGaN/GaN HEMTs

Ruonan Wang; Yong Cai; Wilson C. W. Tang; Kei May Lau; Kevin J. Chen

doi:https://doi.org/10.7567/SSDM.2006.E-9-3

2006 International Conference on Solid State Devices and Materials

2006年9月12日〜 2006年9月15日
PACIFICO Yokohama, Yokohama, Japan

[E-9-3] Device Isolation by Plasma Treatment for Planar Integration of E/D-mode AlGaN/GaN HEMTs

Ruonan Wang、Yong Cai、Wilson C. W. Tang、Kei May Lau、Kevin J. Chen (1.Department of Electrical and Electronic Engineering, Hong Kong University of Science and Technology)

https://doi.org/10.7567/SSDM.2006.E-9-3

▲