Key mechanisms for improved EM lifetime of CoWP capped Cu interconnects

Yumi Kakuhara; Naoyoshi Kawahara; Kazuyoshi Ueno; Noriaki Oda

doi:https://doi.org/10.7567/SSDM.2006.G-1-3

2006 International Conference on Solid State Devices and Materials

2006年9月12日〜 2006年9月15日
PACIFICO Yokohama, Yokohama, Japan

[G-1-3] Key mechanisms for improved EM lifetime of CoWP capped Cu interconnects

Yumi Kakuhara、Naoyoshi Kawahara、Kazuyoshi Ueno、Noriaki Oda (1.NEC Electronics Corporation, Advanced Device Development Division、2.Shibaura Institute of Technology, Dept. of Electronic Engineering)

https://doi.org/10.7567/SSDM.2006.G-1-3

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