[G-7-2] CuAl Alloy Interconnects as a Solution to the Trade-off between Reliability and Defect Density

T. Furusawa, D. Kodama, H. Miyazaki, M. Matsumoto, J. Izumitani, H. Matsumoto, S. Fukui, K. Hashimoto, S. Tawa, M. Okada, K. Tomita, Y. Nagaki, Y. Minoura, A. Ishii, N. Amou, K. Mori, K. Maekawa, N. Suzumura, K. Honda, Y. Hirose, A. Osaki (1.Renesas Technology Corp., 2.Renesas Semiconductor Engineering Corp., 3.LTec Corp.)

https://doi.org/10.7567/SSDM.2006.G-7-2