[G-9-5] An Excellent Cu Diffusion Barrier for Next Generation Multi-level Cu-interconnect
Chia-Jung Lee, Chih-Feng Huang, Bing-Yue Tsui
(1.Department of Electronics Engineering & Institute of Electronics, National Chiao Tung University)
https://doi.org/10.7567/SSDM.2006.G-9-5