[G-9-5] An Excellent Cu Diffusion Barrier for Next Generation Multi-level Cu-interconnect

Chia-Jung Lee、Chih-Feng Huang、Bing-Yue Tsui (1.Department of Electronics Engineering & Institute of Electronics, National Chiao Tung University)

https://doi.org/10.7567/SSDM.2006.G-9-5