[G-9-6] Plasma-enhanced polymerization thin films as a drift barrier for Cu interconnects

Takenobu Yoshino、Jun Kawahara、Nobuhiro Hata、Yoshinori Shishida、Takamaro Kikkawa (1.MIRAI-Advanced Semiconductor Research Center (ASRC), National Institute of Advanced Industrial Science and Technology、2.MIRAI-Association of Super-Advanced Electronics Technology (ASET)、3.Research Center for Nanodevices and Systems (RCNS), Hiroshima University)

https://doi.org/10.7567/SSDM.2006.G-9-6