[H-1-1] Direct Silicon Bonded (DSB) Mixed Orientation Substrate for High Performance Bulk CMOS Technology

C. Y. Sung、Haizhou Yin、H. Ng、K. L. Saenger、G. Pfeiffer、V. Chan、R. Zhang、J. Li、J. A. Ott、R. Bendernagel、S. B. Ko、Z. Ren、X. Chen、V. Ku、Z. J. Luo、N. Rovedo、K. Fogel、M. Khare、G. Shahidi、S. Crowder (1.Research Division, T.J. Watson Research Center、2.Semiconductor Research & Development Center、3.Microelectronic Division)

https://doi.org/10.7567/SSDM.2006.H-1-1