Sub-Atmospheric Chemical Vapor Deposition Process for Chip-to-Wafer 3-Dimensional Integration

Hirokazu Kikuchi; Yusuke Yamada; Atif Mossad Ali; Takafumi Fukushima; Tetsu Tanaka; Mitsumasa Koyanagi

doi:https://doi.org/10.7567/SSDM.2006.P-2-15

[P-2-15] Sub-Atmospheric Chemical Vapor Deposition Process for Chip-to-Wafer 3-Dimensional Integration

Hirokazu Kikuchi、Yusuke Yamada、Atif Mossad Ali、Takafumi Fukushima、Tetsu Tanaka、Mitsumasa Koyanagi (1.Dept. of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University)

https://doi.org/10.7567/SSDM.2006.P-2-15

2006 International Conference on Solid State Devices and Materials

[P-2-15] Sub-Atmospheric Chemical Vapor Deposition Process for Chip-to-Wafer 3-Dimensional Integration