Device Performance and Reliability Considerations of Biaxially Strained Si by Wafer-Bonding-Technology

W. Y. Loh; D. S. H. Chan; D. Y. J. Choo; S. M. Koh; R. Yang; X. W. Zhang; C. Cai; G. Q. Lo; D-L Kwong

doi:https://doi.org/10.7567/SSDM.2007.B-6-2

2007 International Conference on Solid State Devices and Materials

2007年9月18日〜 2007年9月21日
Tsukuba International Congress Center (EPOCHAL TSUKUBA), Ibaraki, Japan

[B-6-2] Device Performance and Reliability Considerations of Biaxially Strained Si by Wafer-Bonding-Technology

W. Y. Loh、D. S. H. Chan、D. Y. J. Choo、S. M. Koh、R. Yang、X. W. Zhang、C. Cai、G. Q. Lo、D-L Kwong (1.Institute of Microelectronics、2.National University of Singapore、3.Institute of High Performance Computing)

https://doi.org/10.7567/SSDM.2007.B-6-2

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