Device Performance and Reliability Considerations of Biaxially Strained Si by Wafer-Bonding-Technology

W. Y. Loh; D. S. H. Chan; D. Y. J. Choo; S. M. Koh; R. Yang; X. W. Zhang; C. Cai; G. Q. Lo; D-L Kwong

doi:https://doi.org/10.7567/SSDM.2007.B-6-2

2007 International Conference on Solid State Devices and Materials

Sep 18, 2007 - Sep 21, 2007
Tsukuba International Congress Center (EPOCHAL TSUKUBA), Ibaraki, Japan

[B-6-2] Device Performance and Reliability Considerations of Biaxially Strained Si by Wafer-Bonding-Technology

W. Y. Loh, D. S. H. Chan, D. Y. J. Choo, S. M. Koh, R. Yang, X. W. Zhang, C. Cai, G. Q. Lo, D-L Kwong (1.Institute of Microelectronics, 2.National University of Singapore, 3.Institute of High Performance Computing)

https://doi.org/10.7567/SSDM.2007.B-6-2

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