[C-8-2] Improvement of Adhesion at the Interface between Low-k Spin-on Dielectric and underlying SiCO Barrier by Plasma Treatments

Y. Takigawa、S. Nakao、M. Shiohara、N. Oda、S. Ogawa (1.Semiconductor Leading Edge Technologies, Inc.)

https://doi.org/10.7567/SSDM.2007.C-8-2