Effect of temperature and film thickness on resistivity of CoWP

J. Gambino; F. Chen; S. Mongeon; D. Meatyard; E. Adams; P. DeHaven; C. Cabral Jr; I. Ivanov

doi:https://doi.org/10.7567/SSDM.2007.C-8-3

2007 International Conference on Solid State Devices and Materials

Sep 18, 2007 - Sep 21, 2007
Tsukuba International Congress Center (EPOCHAL TSUKUBA), Ibaraki, Japan

[C-8-3] Effect of temperature and film thickness on resistivity of CoWP

J. Gambino, F. Chen, S. Mongeon, D. Meatyard, E. Adams, P. DeHaven, C. Cabral Jr, I. Ivanov (1.IBM Microelectronics, 2.IBM Thomas J. Watson Research Center, 3.Blue29 LLC)

https://doi.org/10.7567/SSDM.2007.C-8-3

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